SMT不良现象中英文对照表- 不良現象中英文對照表1.缺件(MISSING PARTS) 2.錯件(WRONG PARTS) 3.多件(EXCESSIVE PARTS) 4.短路(SHORT...首页文档学前教育基础教育高校与高等教育语言/资格考试实用模板法律建筑互联网行业资料政务民生说明书生活娱乐文档工具更多搜索文档续费VIP立即续费VIP会员中心VIP福利社VIP免费专区VIP专属特权客户端看过暂无浏览记录店铺后台店铺首页个人中心会员中心消息收藏意见反馈退出登录中英文对照表机械/仪表工程科技SMT不良现象中英文对照表4.2分（超过89%的文档）1.1W阅读633下载2011-04-14上传4页收藏分享存网盘举报APP客户端打开不良現象中英文對照表1.缺件(MISSING   PARTS)                        28.腳未彎(PIN NOT BENT)                        55.印章錯誤(WRONG STAMPS)2.錯件(WRONG  PARTS)                         29.缺蓋章(MISSING STAMP)                        56.尺寸錯誤(DIMENSION WRONG)3.多件(EXCESSIVE  PARTS)                        30.缺標籤(MISSING LABEL)                        57.二極體壞(DIODE NG)4.短路(SHORT)                        31.缺序號(MISSING S/N)                        58.電晶體壞(TRANSISTOR NG)5.斷路(OPEN)                        32.序號錯(WRONG S/N)                        59.振盪器壞(X’TL NG)6.線短(WIRE  SHORT)                        33.標籤錯(WRONG LABEL)                        60.管裝錯誤(TUBES WRONG)7.線長(WIRE LONG)                        34.標示錯(WRONG MARK)                        61.阻值錯誤(IMPEDANCE WRONG)8.拐線(WIRE POOR DDRESS)                        35.腳太短(PIN SHORT)                        62.版本錯誤(REV WRONG)9.冷焊(COLD SOLDER)                        36.J1不潔(J1 DIRTY)                        63.電測不良(TEST FAILURE)10.包焊(EXCESS  SOLDER)                        37.錫凹陷(SOLDER SCOOPED)                        64.版本未標(NON REV LEBEL)11.空焊(MISSING  SOLDER)                        38.線序錯(W/L OF WIRE)                        65.包裝損壞(PACKING DAMAGED)12.錫尖(SOLDER  ICICLE)                        39.未測試(NO TEST)                        66.印章模糊(STAMPS DEFECTIVE)13.錫渣(SOLDER  SPLASH)                        40.VR變形(VR DEFORMED)                        67.標籤歪斜(LABEL TILT)14.錫裂(SODER  CRACK)                        41.PCB翹皮(PCB PEELING)                        68.外箱損壞(CARTON DAMAGED)15.錫洞(PIN  HOLE)                        42.PCB彎曲(PCB TWIST)                        69.點膠不良(POOR GLUE)16.錫球(SOLDER  BALL)                        43.零件沾膠(GLUE ON PARTS)